Teradyne and Cadence Address Improved Test and Diagnostic Flow for Nanometer Devices
Joint project with Cadence assures first-time correct test
programs and efficient diagnostics flow enabling higher yielding
devices for today's most challenging nanometer designs
BOSTON—(BUSINESS WIRE)—Dec. 12, 2005—
Teradyne, Inc. (NYSE:TER) a leading supplier of Automatic Test
Equipment, today announced a validated flow for test and yield
diagnostic information between the Teradyne(R) FLEX(TM) Platform and
Cadence(R) Encounter(TM) Test from Cadence Design Systems Inc. The
Teradyne family of test systems running the IG-XL(TM) software system
now supports Encounter True-Time Delay Test patterns in industry
standard STIL or WGL format and Encounter Diagnostics CPP format. The
validation of this flow assures joint customers of an optimal and
efficient experience as they seek to increase product quality and
improve device yields.
Improved Delay Tests Improve Product Quality
Efficient testing of nanometer devices requires proven links
between Automatic Test Equipment (ATE) and Automatic Test Program
Generation (ATPG). A validated flow assures test programs will
function correctly the first time and be able to detect subtle delay
defects common in today's nanometer devices. The Cadence Encounter
True-Time Delay Test ATPG solution is unique in that it creates test
patterns that can run faster than at-speed on ATE, enabling more
productive test coverage than traditional delay testing which can miss
a significant number of delay defects. In addition, True-Time Delay
Test is unique in the industry as it constrains pattern generation to
the timing capabilities of the tester, assuring its patterns will run
the first time in production. Finally, to assure the highest possible
quality, Encounter True-Time Delay Test uses actual post-layout design
timing information to assure it can detect the smallest defects, such
as resistive opens and shorts.
"It is essential to have a good match between ATPG and ATE
capabilities especially to detect critical delay defects so common in
designs at 90nm," said Hap Walker, System Architect, Teradyne. "This
is why we worked with Cadence to assure a working flow with our FLEX
architecture. When used in conjunction with Encounter True-Time Delay
Test, our mutual customers can easily leverage the best attributes of
both products resulting in higher product quality and lower test
costs."
Validating the Diagnostics Flow
Teradyne and Cadence also validated a path from Teradyne ATE to
Encounter Diagnostics, assuring customers of rapid resolution of ATE
failures which is essential in any yield enhancement flow.
"At 90nm it is essential to identify and quickly resolve systemic
defects which have traditionally been difficult to isolate within
silicon," stated Sanjiv Taneja, general manager, Encounter Test at
Cadence. "To enable better yield enhancement efforts, a tight link is
required between ATE and the diagnostic engine so large volumes of ATE
failure data can be easily analyzed during high-volume testing."
Encounter Diagnostics accelerates nanometer yield ramp in
high-volume manufacturing environments. In volume mode, the tool
identifies critical yield limiters based on analysis of test failures
from ATE. Efficiency dictates compatibility between ATE and the
diagnostics solution so that ATE fail data can be quickly analyzed and
acted upon. Teradyne validated its failure logs to assure their
compatibly with Encounter Diagnostics' Chip Pad Pattern (CPP) format.
About FLEX
The Teradyne FLEX Test Platform advances multiple technologies in
a test architecture designed for high-efficiency, multi-site test. The
Platform offers multiple systems so customers can optimize for
performance, capacity and capital cost to achieve lower cost-of-test.
FLEX Platform systems span test requirements from DFT and structural
test to standard analog and mixed-signal to the latest
high-integration System-on-a-Chip (SOC) and System-In-Package (SIP)
devices for consumer, automotive, mass storage, wireless, and data
communications applications. The FLEX Platform architecture delivers
instrument synchronization and control in device clock time on a
vector-by-vector basis, even in multiple time domains. A Universal
Slot test head design allows easy reconfiguration for changing test
needs. The IG-XL(TM) software operating system provides fast program
development, including instant conversion from single to multi-site
test. And, the OpenFLEX(TM) open system architecture complements the
FLEX Platform's broad set of high-density instrumentation, allowing
focused instruments to be added and further enhance system performance
and test economics. To learn more about the FLEX Platform, visit
http://www.teradyne.com/flex/.
About Teradyne
Teradyne (NYSE:TER) is a leading supplier of Automatic Test
Equipment. The company's products deliver competitive advantage to the
world's leading electronics companies. In 2004, Teradyne had sales of
$1.8 billion, and currently employs about 4,100 people worldwide. For
more information, visit www.teradyne.com. Teradyne(R) is a registered
trademark of Teradyne, Inc. in the US and other countries. All product
names are trademarks of Teradyne, Inc. (including its subsidiaries) or
their respective owners.
Contact:
Teradyne, Inc.
Karen Kilcoyne, 508-833-2354
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